FINEPLACER® femto - Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced flip chip bonding and die attach applications. This field approved system offers modular application architecture and can be flexibly equipped for a wide range of die bonding applications and processes. It is an ideal system for production environments, as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.