TOM 1- Silicon Photonics and Guided-Wave Optics

Location: 
Delft, Netherlands
Duration: 
8 October 2018 - 12 October 2018




Chairs

Graham Reed,
University of Southampton (United Kingdom)
Pavel Cheben,
National Research Council Canada (Canada)

 

Synopsis

The focus of this topical meeting is to explore new trends and applications, particularly, in the field of Silicon Photonics, but also in Guided-Wave Optics and related areas. The applications range from devices for data centre applications to Mid Infrared (MIR) sensing. New developments on fibre and planar waveguide lasers, fibre non-linearities, nanophotonic materials and devices will also be welcome. Potential topics include, but are not limited to, the design, simulation, modelling and fabrication of optical interconnects, (all) optical (on chip) routing architectures and technologies, as well as related design concepts for high speed, low power photonic integrated circuits (PICs). Also (CMOS-compatible) optical sources and detectors and the optimization of light emission and absorption for data processing using materials such as SiGe TaO5, SiN or III/IVs etc. are welcomed. Advanced monolithic and hybrid processing techniques for the fabrication of photonic structures will also be considered. Finally, devices and strategies for the advancement of PICs in silicon and other materials, including advances in testing and packaging would also be welcome.

 


Plenary Speaker

 



 
Silicon nanohotonics  - the past, present and future
Laurent Vivien, University Paris Sacle and CNRS France

 Laurent Vivien received the Ph.D. degree in physics from the Polytechnique School, Palaiseau Cedex, France, in 2001. His Ph.D. Thesis was on nonlinear optical properties of carbon nanotubes for optical limiting.Between 2001 and 2003, he held a postdoctoral position with the Institute of Fundamental Electronics (IEF), Orsay, France, where studied single-mode and polarization-insensitive structures in silicon-on-insulators and the coupling from sub-micrometric waveguides to single mode fiber for optical telecommunication applications. Since 2003 he has joined the CNRS at the Institute of Fundamental Electronics where his activities are related to passive (waveguide, splitters, 90° turns, optical couplers) and active (Si-based optical modulators and Ge on Si photodetectors) micro and nanophotonic devices on silicon for optical interconnects and optical fiber communications.

 

Invited Speakers

  • Pierre Berini, University of Ottawa, Canada; Surface Plasmon Optoelectronics on Silicon
  • Robert Halir, University of Malaga, Spain; Designing high performance devices with silicon subwavelength structures
  • Hon Ki Tsang, Chinese University of Hong Kong, China; Carrier Dynamics and Engineering of High speed Hybrid integrated graphene photodetectors
  • Ivo Rendina, National Council of Research, Italy  
  • Thomas Krauss, York University, United Kingdom; 2D Material microcavity laser-like emitters on silicon
  • Andrew Knights, McMaster University, Canada
  • Günther Roelkens, Ghent University, Belgium; High speed silicon photonic transceivers
  • Frederic Gardes, University of Southampton, United Kingdom; Group IV compounds and tunable index silicon nitride for CMOS photonics
  • Francesco Morichetti, Politecnico di Milano, Italy; Automatic control strategies for silicon photonic circuits
  • Otto Muskens, University of Southampton, United Kingdom; Controlling and measuring light on a silicon chip using ultrafast lasers and nanoplasmonics
  • Gianni Preve, Inphotec, Italy; Optical interconnection for Silicon photonics devices: the Teraboard project solution and results
  • Andreas Hakansson, Sicoya, Germany; Towards high volume Silicon Photonic 400G O-band transceivers using 130nm Bi-CMOS FEOL technology
  • Felix Eltes, IBM Zurich (Switzerland); Silicon photonics enhanced with nonlinear barium titanate thin films

 


Topics include (but are not limited to)

  • Design, simulation, modelling and fabrication of optical interconnects
  • (All) optical (on chip) routing architectures and technologies
  • MIR devices, sensors and photonic circuits
  • on-chip light sources
  • Passive alignment
  • Low cost methods for lasers on-chip
  • Low power optical modulators
  • Related design concepts for high speed, low power photonic integrated circuits (PICs)
  • (CMOS-compatible) optical sources and detectors
  • Advanced monolithic and hybrid processing techniques for the fabrication of photonic structures
  • Devices and strategies for the advancement of PICs in silicon and other materials (including advances in testing and packaging )
  • Hybrid and monolithic integration on silicon platforms
  • Strategies for wafer scale testing
  • Strategies for coupling to and from photonic circuits
  • Athermal device design

 

Program Committee

  • Trevor Benson, University of Nottingham, United Kingdom
  • Marc Sorel, University of Glasgow, United Kingdom
  • Pablo Sanchis, Universitat Politècnica de València, Spain
  • Delphine Marris-Morini, Université Paris Saclay, France
  • Scott Reynolds , University of Southampton, United Kingdom