Advanced Optical 3D Imaging

Advanced Optical 3D Imaging

This is a sub-conference of Frontiers in Electronic Imaging, held under the umbrella of the WORLD OF PHOTONICS CONGRESS 2009, from 15 - 17 June, 2009. Please click here to download the Call for papers.

Synopsis

Essentially, three basic techniques for optical 3D imaging are known: triangulation (active or passive stereo vision), interferometry (monochromatic, multiple wavelength, white-light interferometry, or optical coherence tomography), and time-of-flight range imaging. For all three methods, the performance of these optical 3D techniques is ultimately limited by the performance of the solid-state image sensors that are used to implement them. For this reason, this conference is devoted to the architectures of custom, solid-state image sensors and novel smart pixels whose functionality and performance is optimized for one special optical 3D imaging technique.

Topics include, but are not limited to:

• Custom image sensors for passive triangulation (stereo)
• Custom image sensors for active triangulation (pattern projection)
• Custom image sensors for monochromatic interferometry
• Custom image sensors for optical coherence tomography (OCT)
• Custom image sensors for time-of-flight 3D range imaging
• Lock-in and demodulation pixels
• Time-of-arrival and gating measurement techniques
• In-pixel waveform analysis
• Drift-field techniques for high-speed charge domain processing
• Event-driven image sensing
• Application examples with record performance

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Chairs

• General Chair: Peter Seitz, University of Neuchatel and CSEM Nanomedicine, Landquart (CH) 
• Edoardo Charbon, Technical University Delft (NL)
• Andrea Simoni, ITC-irst, Trento (IT)

Scientific Committee

• Peter Seitz, University of Neuchatel (CH) and CSEM Nanomedicine, Landquart (CH)
• Edoardo Charbon, Technical University Delft (NL)
• Bart Dierickx, Caeleste CVBA, Antwerp (BE)
• Boyd Fowler, Fairchild Imaging Inc., Milpitas (US)
• Shoji Kawahito, Shizuoka University, Hamamatsu (JP)
• Stefan Lauxtermann, Teledyne Imaging Sensors, Camarillo (US)
• Andrea Simoni, ITC-irst, Trento (IT)  

Invited speaker

• Bedrich Hosticka, Fraunhofer Institute for Microelectronics, Duisburg (DE)

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Abstract Submission and Deadlines

• Submission will open in December 2008 
• Deadline for submission of abstracts: 26 January 2009
• Notification to authors: 19 February 2009
• Publication of the programme: April 2009

Prospective authors are requested to submit an abstract covering a minimum of half a page and a maximum of two pages. All accepted abstracts will be published in the EOS Conference digest that will be available on-site at the beginning of the conference.  Abstracts shall be submitted online at www.myeos.org/MUNICH2009 with the responsible author’s contact data. The EOS guidelines for abstracts can be downloaded at www.myeos.org/abstractguidelines. Submission will open at a later date.

JEOS:RP - Special Publication Offer

The authors of accepted abstracts receive a 20% discount on the publication rate for JEOS:RP, the e-journal of the European Optical Society (www.jeos.org). The paper submitted to JEOS:RP must be an original contribution that is connected to the conference presentation and must be submitted no later than 15 August, 2009. The publication rate for authors of the event is 280€ (instead of 350€).

Registration

The registration for this EOS conference includes admission to all conferences of the WORLD OF PHOTONICS CONGRESS 2009 as well as to the LASER World of PHOTONICS 2009 exhibition. Please register via the EOS online shop at www.myeos.org/shop. Registration will open in 2009. Deadline for early-bird registration: 4 May 2009.

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Contact

European Optical Society (EOS)
Event & Account Management
Hollerithallee 8
30419 Hannover, Germany

Phone: +49-511-2788-159
Fax: +49-511-2788-119

E-mail: munich@myeos.org
URL: www.myeos.org/MUNICH2009

Sub-Conferences

• Frontiers in Electronic Imaging
• Single-Photon Imaging
• Application-Specific, High-Performance Image Sensors
• New Materials for Electronic Imaging
• Advanced Optical 3D Imaging